MediaTek Inc.
IC Design Engineer — 5G Modem Frontend
MediaTek is the world's largest fabless semiconductor company by revenue, designing chips for smartphones (Dimensity series), smart TVs, IoT devices, Wi-Fi routers, and automotive applications. Headquartered in Hsinchu Science Park, MediaTek shipped over 2 billion chips in 2024 alone and is a TWSE top-10 listed company by market capitalization. For engineering students, a MediaTek internship is one of the most prestigious and well-compensated opportunities in Asia's semiconductor industry.
Job Description
About the Role
Contribute to RTL design and verification of the Dimensity 5G chipset series — the most widely shipped 5G modem platform in the world, powering flagships from Xiaomi, OPPO, Samsung, and Sony.
Key Responsibilities
RTL design for 5G NR physical layer blocks: LDPC/Polar codecs, OFDM modulators, channel estimators
Functional verification using SystemVerilog/UVM testbenches
Logic synthesis and static timing analysis (STA)
Power analysis and optimization for mobile battery life
FPGA prototyping and silicon validation support during tape-out
Required Qualifications
Master's or PhD in EE, Communications Engineering, or Computer Engineering
Proficiency in Verilog or SystemVerilog
Understanding of 5G NR physical layer standards (3GPP Release 15+)
Knowledge of DSP: FFT/IFFT, FIR/IIR filters, channel coding
Basic Mandarin for team communication
Preferred Qualifications
Thesis related to 5G/6G, OFDM, MIMO, or channel coding
Experience with UVM-based verification methodology
Publications at IEEE conferences (VTC, ICC, ISSCC) are a strong plus
Benefits & Perks
Industry-Leading Compensation
Monthly salary: 80,000–120,000 TWD
Annual bonus: 3–6 months' salary
MediaTek stock options (TWSE:2454)
Patent incentive: 10,000–50,000 TWD per approved patent
Company-subsidized housing first year (4,500 TWD/month)
15 days annual leave from Day 1