industry Taiwan Scholarship
Hsinchu Science Park Industry-Academia Scholarship
NT$50,000/semester• Deadline: June 20, 2026
Scholarship Coverage
Monthly Living Stipend
Master/PhD in EE or CS, commit to internship at sponsor
Eligibility Requirements
- Minimum GPA: 3.5
- English Proficiency: TOEFL 80 (TOEIC/IELTS/TOEFL)
- Chinese Proficiency: basic (TOCFL)
- Eligible Degrees: All Degrees
Apply Now
Deadline: June 20, 2026